Product : IR-E6 Evaluations

IR-E6 Evolution


The PDR IR-E3 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.

The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.

The IR-E3 can be easily configured to your requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4000 customers.

Simple BGA rework procedure

BGA rework poses the problem of accessing hidden interconnects in a high density environment. Consequently, it requires a system that is able to access the hidden joints without affecting neighbouring components. A system that is safe, gentle, adaptable and, above all, simple to operate. The IR-E3 is such a system. It is so easy to operate that technicians are able to instantly achieve excellent process control for BGA/SMT rework without the complexities and frustrations normally associated with ‘high-end’ rework systems.

Paste - Place - Reflow

With the aid of excellent mechanics, optics and control, operators can simply pick up the fluxed BGA from the nest, align it, place it onto the PCB’s pads and then reflow with the system’s accurate PC based, closed loop component and PCB temperature control.


Advanced Features Available

  • Advanced Focused IR component heating
    150W, lens based Focused IR heating with    adjustable image system
  • Quartz IR PCB preheating
    3200W, two zone (500mm x 270mm heating area)

  • Precision Component Pick and Placement
    Advanced Professional vacuum placement system
  • Component Nest/Flux Application Facility
    Integrated nest with flux dip tray or component    print frame

  • Precision PCB Handling
    Advanced Professional PCB table with macro-micro X/Y
  • Component Temperature Sensing
    Standard non-contact IR temperature sensor

  • PCB Temperature Sensing
    Standard non-contact IR temperature sensor
  • Advanced Thermal Process Control
    Software based auto profile thermal control

  • Camera/Prism Based BGA/CSP/QFN Alignment System
    Split beam prism system for simultaneous PCB/component viewing
  • Auxiliary Process Camera (Optional)
    High magnification camera and LED lighting

  • Forced Air PCB Cooling (Optional)
    Highly effective, integral PCB cooling with air knife system


PDR IR-E6 XL Overview - BGA Rework for 26"/620mm PCBs


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