Product : RW-AT6350U


  • Heater head and suction nozzle designed 2 in 1; functioned with auto-rotate, auto-align, auto-solder and auto-desolder; 
  • Suction nozzle move up individually, able to rework chipset 0101
  • While moving the lower heater, we can adjust its height, which can avoid the problem that the components on PCB are damaged during the lower heater is moving.
  • 7 electric motors controls all actions; vision system, top heating system and under heating system are all controlled by joystick; makes alignment fast;
  • The traditional temperature control  mode of on-off control is replaced by analog quantity control, which makes temperaturemore accurate;
  • Three independent heating systems, temperature and time can be displayed digitally on the touch screen, able to repair difficultly-reworked BGA; with alarm function in abnormal heating;
  • The top heater adopts independent patent design, cooling and heating designed 2 in 1, which makes temperature controlmore accurate;
  • The bottom heater is consist of 6 pieces of imported light-wave heating tube. With high-temperature glass plate, heating can be controlled individually. 
  • Bottom preheat area can be adjusted according to PCB size to heat the PCB evenly to avoid deformation and keep soldering effect; With function of over-heating protection and environment-friendly.
  • Top heater driven by servo motor; suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range; 
  • Both upper and lower hot-air heating head are movable on the IR preheating area to fit for reworking BGA in different positions on PCB.
  • PCB support holder can be pulled out and set length, which is easy for clamping PCB
  • Laser pointer for alignment, easy for fixing PCB
  • With function of Bar code scanner reading program;
  • Color optical system with functions of split vision, zoom - in and micro-adjustment, equipped with aberration  detection device; with auto focus and software operation function,27X optical focus; able to rework BGA sized up to 70mm*70mm;
  • Touch screen interface, PLC control; able to display set temperature curves and five detecting temperature curves at the same time; 8 segments of temperature up (down) and 8 segments constant temperature control, more than 50000 groups of  profile can be stored.; Profile analysis can be carried out on the touch screen;
  • Built in vacuum pump; max. vacuum suction up to 80g,which can be micro-adjusted. Suction  nozzle can be rotated in 360°;
  • The supports rack can be adjusted to restrain the local sinkage of the BGA soldering area;
  • Finished the BGA rework process under the nitrogen save through remain the nitrogen joggle in advance, have special function for saving nitrogen to save cost.
  • Heater head and mounting head are designed 2 in 1 ,auto memorize different BGA heating positions and alignment positions;
  • Alloy nozzle can be located in 360°;
  • Adjustable universal BGA Reballing Kit, fixed BGA Reballing Kit (can be custom-made)
  • Common stencils for laptop BGA 33pcs/set
  • Universal stencils or particular stencils (can be custom-made)
  • Equipped with different suction nozzles in various specification;
  • Equipped with different alloy hot air nozzles (can be custom-made)

Advanced Specification

Max PCB size 400X500mm
Workable area :400X500mm
PCB thickness :0.5-5mm
Max thickness :8mm with custom-made jig
Max size      :70mm x 70mm
Min size      :1mm x 1mm
Max weight    :80g
Accuracy      :20um
Temperature control 
Upper heater  :350℃
Lower heater  :350℃
Bottom heater :300℃
Control model 16 zones of programmable temperature setting  for profile
Power consumption System total power 8000W
Upper heater :1000W
Lower heater :1000W
Bottom heater :6000W
Dimension     :870*920*1580mm
Weight Appox  :300KG
Input voltage :Single phase AC 220V  50/60Hz   8.0KW

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Contact Details

37–B, Venkatesanagar 2nd Main Road,
Extension – II, Virugambakkam,
Chennai – 600 092, Tamil Nadu, India

  91-44-2376 22 98 /

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