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Product : BGA-inspection

BGA-inspection

Overview of X-Ray Examination Equipment

Applications of X-ray Examination Technology
Hidden solder joint (ex BGA)
Densely packed solder joint (ex BGA) for which installation of test probe is difficult Areas for which camera photography is difficult due to mirror surface  (ex, solder joint monitoring equipment following Reflow process)  Advantage: expedient examination (vs destructive examination)
Purposes of Usage
- Detection of defectiveness : 
Key examination items: bridging, open, insufficient, excess,  missing balls, misregistration, package "popcorning",  - Analysis of error in procedure :
Trend analysis: solder volume, solder joint shape
- Quality analysis
 
For effective examination

- X-ray image acquisition technology
- Understanding of technology of X-ray image analysis

 


Features

Technology for acquisition of X-ray image (Solder Joint examination area)
 
  - Ffilm based X-ray Inspection
    Process is complex, need specialization,  slow, Although high cost of image taking, one can obtain precision image.

Figure 46 X-ray Laminography Images of CBGA Solder Joints

Figure 46 X-ray Laminography
Images of CBGA Solder Joints
  - Ffilm based X-ray Inspection
    Process is complex, need specialization, slow, Although high cost of image taking, one can obtain precision image.
   
Technology for acquisition of X-ray image (Solder Joint examination area)
     

- Real time X-ray system
    Although the disadvantages of Film based technology has been overcome, there are problems of Voltage blooming and pincushion distortion
    → Overcome with Flat Detector technology, high cost
- Diverse range of sizes:
    desk top~10 M x 10 M
    Diverse range of voltages: several kV ~ several  hundreds of kV
- What is the Voltage appropriate for BGA examination?
    Structure of copper thermal radiator  requires Higher Voltage High-Sensitivity camera requires Lower Voltage

Popcorning
Figure 44 X-Ray Can Be Used to Detect BGA Package
"Popcorning" (PincushionDistortion)
  Technologies for Analysis of Soldering Status
 
  >Transmission  

It=Io exp(-¥iT), appears darker if the thickness of the lead is thicker. Lines are expressed as points without distinction of front from the back Collection of cone shaped lines.

Figure 47 Transmission Example
  >Scanning Acoustic Microscopy (SAM)
Ultrasound wave, examine by immersing in medium 
(water, alcohol), 230 MHz → 25 μGap
a-SAM - point
b-SAM - line
c-SAM - surface
Effective in examination of void within under fill
Figure 49 Scanning Acoustic Microscopy

Specification


>Feeler Gage

Gap gauge, measurement of stand-off of rectangular corner, inaccurate 
convenient, low cost
  >BGA Stand-off measurement
laser, contact sensor reflow - uniformity, 
0.75mm ball
0.60mm → 0.45 mm , after reflow
 

>Destructiveanalysis methods
From the perspective of solving problem, destruction of samplebr

- Cross-sectioning

  Molded with resin ->presumption of location   There are many cases of accidental occurrence of open and crack in the process of examination. 

- Dye Penetrant
    Observe by infiltrating with dye and fluorescent material (UV light) 

Destructiveanalysis methods
Destructiveanalysis methods
Destructiveanalysis methods
A BGA inspection that is produced by XAVIS is a well made X-ray inspection. XAVIS’ BGA inspection is highly efficient and low priced equipment that can be used for hidden solder joint, densely packed solder joint for which installation of test probe is difficult and areas for which camera photography is difficult due to mirror surface. We put our efforts on producing our BGA inspection which does not cause the destructive examination. Xavis exports BGA inspection worldwidely, and our BGA inspection gives satisfaction to our customers. Check our website formore information of BGA inspection
 
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