Product : SuperBot-I Automated IC Programmer

SuperBot-I Automated IC Programmer


  • High throughput, up to 1200 UPH
  • Four built-in SuperPro 7000 programmers, each with up to 4 sockets (16 sockets total).
    Throughput rate is 30 times faster than SuperBot-1 for eMMC devices.
  • Supports tray, tape and tube input and output
  • Supports laser and ink marking
  • Short change-over time
  • Intelligent software cuts learning curve and setup time while simplifying task management
  • Compact chassis design
  • CE and RoHS Compliant





Advanced Features Available

Expanded Features

  • The largest device support in the industry 
  • Utilizes industrial personal computer (with control card inside).
  • Built-in servo and vision system mode to quickly and accurately locate and complete chip capture, placement, programming and packaging automatically.
  • Four built-in internal SuperPro 5000 modules. Efficiency is much higher than parallel-production programmers because each module burns chips independently.
  • Advantages:
    • Modularizing system design capability.
    • Improved switching time.
    • High throughput (1400 devices per hour).
    • Competitive quote.
  • Supports standard Tray & Tape Reel and Tube input & output for IC packages.


  • Throughput Up to 1400 UPH (units per hour) handler index time with zero programming time for SuperBOT-I.
  • Content High performance control card & servo drive system.
  • Resolution X axis: (+/-)0.02mm; Y axis:(+/-) 0.02mm; Z axis: (+/-)0.05mm.
  • Max. stroke X axis: 500 mm; Y axis: 380mm; Z axis:60mm.
  • Pick & Place head placement accuracy (+/-) 0.08mm.

Vision System

  • Camera 400*400 pixels.
  • Vision resolution 0.1mm.
  • Process time per view ~0.5sec

I/O Devices

Tray : The standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray. 
Auto tray :This device includes Tray in and Tray out. Trays could be added or removed without stopping machine operation (up to 15 trays).
Tape-in Device : An input device for tapes with IC packaging. Devices must be modified for custom IC size. 
Tape-out Device :An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device

Assisted Control

  • Built-in Control : PC-based control with Windows XP.
  • Display : LCD monitor.
  • Data entry : Keyboard & mouse
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